Commission Delegated Directive (EU) 2020/363 of 17 December 2019 amending Annex II to Directive 2000/53/EC of the European Parliament and of the Council on end-of-life vehicles as regards certain exemptions for lead and lead compounds in components (Text with EEA relevance)
(1) entry 8(e) is replaced by the following: "8(e). Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) ( 2 )X" (2) entry 8(f)(b) is replaced by the following: "8(f)(b). Lead in compliant pin connector systems other than the mating area of vehicle harness connectors Vehicles type-approved before 1 January 2024 and spare parts for these vehiclesX" (3) entry 8(g) is replaced by the following: "8(g)(i). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages Vehicles type approved before 1 October 2022 and spare parts for these vehiclesX 8(g)(ii). Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following: (i) a semiconductor technology node of 90 nm or larger; (ii) a single die of 300 mm 2 or larger in any semiconductor technology node;(iii) stacked die packages with dies of 300 mm 2 or larger, or silicon interposers of 300 mm2 or larger.
( 2 )Valid for vehicles type-approved from 1 October 2022 and spare parts for these vehiclesX" (4) the following entry 8(k) is inserted: "8(k). Soldering of heating applications with 0,5 A or more of heat current per related solder joint to single panes of laminated glazings not exceeding wall thickness of 2,1 mm. This exemption does not cover soldering to contacts embedded in the intermediate polymer Vehicles type approved before 1 January 2024 and spare parts for these vehiclesX( 4 )"