Lead as an alloying element1(a)Steel for machining purposes and batch hot dip galvanised steel components containing up to 0,35 % lead by weight | | |
1(b)Continuously galvanised steel sheet containing up to 0,35 % lead by weight | Vehicles type approved before 1 January 2016 and spare parts for these vehicles | |
2(a)Aluminium for machining purposes with a lead content up to 2 % by weight | As spare parts for vehicles put on the market before 1 July 2005 | |
2(b)Aluminium with a lead content up to 1,5 % by weight | As spare parts for vehicles put on the market before 1 July 2008 | |
2(c)Aluminium with a lead content up to 0,4 % by weight | | |
3.Copper alloy containing up to 4 % lead by weight | | |
4(a)Bearing shells and bushes | As spare parts for vehicles put on the market before 1 July 2008 | |
4(b)Bearing shells and bushes in engines, transmissions and air conditioning compressors | 1 July 2011 and spare parts for vehicles put on the market before 1 July 2011 | |
Lead and lead compounds in components5.Batteries | | X |
6.Vibration dampers | Vehicles type approved before 1 January 2016 and spare parts for these vehicles | X |
7(a)Vulcanising agents and stabilisers for elastomers in brake hoses, fuel hoses, air ventilation hoses, elastomer/metal parts in the chassis applications, and engine mountings | As spare parts for vehicles put on the market before 1 July 2005 | |
7(b)Vulcanising agents and stabilisers for elastomers in brake hoses, fuel hoses, air ventilation hoses, elastomer/metal parts in the chassis applications, and engine mountings containing up to 0,5 % lead by weight | As spare parts for vehicles put on the market before 1 July 2006 | |
7(c)Bonding agents for elastomers in powertrain applications containing up to 0,5 % lead by weight | As spare parts for vehicles put on the market before 1 July 2009 | |
8(a)Lead in solders to attach electrical and electronic components to electronic circuit boards and lead in finishes on terminations of components other than electrolyte aluminium capacitors, on component pins and on electronic circuit boards | Vehicles type approved before 1 January 2016 and spare parts for these vehicles | X |
8(b)Lead in solders in electrical applications other than soldering on electronic circuit boards or on glass | Vehicles type approved before 1 January 2011 and spare parts for these vehicles | X |
8(c)Lead in finishes on terminals of electrolyte aluminium capacitors | Vehicles type approved before 1 January 2013 and spare parts for these vehicles | X |
8(d)Lead used in soldering on glass in mass airflow sensors | Vehicles type approved before 1 January 2015 and spare parts of such vehicles | X |
8(e)Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) | | X |
8(f)Lead in compliant pin connector systems | | X |
8(g)Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages | | X |
8(h)Lead in solder to attach heat spreaders to the heat sink in power semiconductor assemblies with a chip size of at least 1 cm2 of projection area and a nominal current density of at least 1 A/mm2 of silicon chip area | | X |
8(i)Lead in solders in electrical glazing applications on glass except for soldering in laminated glazing | Vehicles type approved before 1 January 2016 and after that date as spare parts for these vehicles | X |
8(j)Lead in solders for soldering in laminated glazing | | X |
9.Valve seats | As spare parts for engine types developed before 1 July 2003 | |
10(a)Electrical and electronic components which contain lead in a glass or ceramic, in a glass or ceramic matrix compound, in a glass-ceramic material, or in a glass-ceramic matrix compound.This exemption does not cover the use of lead in:- glass in bulbs and glaze of spark plugs,
- dielectric ceramic materials of components listed under 10(b), 10(c) and 10(d)
| | X (for components other than piezo in engines) |
10(b)Lead in PZT based dielectric ceramic materials of capacitors being part of integrated circuits or discrete semiconductors | | |
10(c)Lead in dielectric ceramic materials of capacitors with a rated voltage of less than 125 V AC or 250 V DC | Vehicles type approved before 1 January 2016 and spare parts for these vehicles | |
10(d)Lead in the dielectric ceramic materials of capacitors compensating the temperature-related deviations of sensors in ultrasonic sonar systems | | |
11.Pyrotechnic initiators | Vehicles type approved before 1 July 2006 and spare parts for these vehicles | |
12.Lead-containing thermoelectric materials in automotive electrical applications to reduce CO2 emissions by recuperation of exhaust heat | Vehicles type approved before 1 January 2019 and spare parts for these vehicles | X |